2019 AD
EUV lithography in foundry volume production
Materials & manufacturing · Semiconductores, litografía y fabricación de precisión
TSMC reported that its 7 nm N7+ process entered volume production in 2019 as the first commercially available foundry technology using extreme-ultraviolet (EUV) lithography. It records industrial introduction of a specific process, not the replacement of all optical lithography or identical performance at every later node.
Precision, calendar, and review
- Start
- year · no uncertainty qualifier in this record
- Calendar and convention
- Historical-era years; the source calendar is not identified. No conversion of days is assumed.
- Year zero
- The scale goes from 1 BCE to 1 CE without year zero. Changing era names changes labels only.
- Documentary review
- Date not recorded
Reading the date: point event.
Sources
- www.tsmc.com (opens in a new tab)
Source provenance and scope
- Publication date
- Pending verification: the source could not be accessed
- Bibliographic date checked
- 2026-09-23
The correspondence between this reference and individual claims has not yet been itemized.
This record is an editorial synthesis. Consult the sources to check claims and their limits. Chronological relationships alone do not establish causation.